Dear Spencer,
Our Keeping IT Cool | Liquid series returns for its second day, bringing together operators, engineers, researchers, and infrastructure specialists to explore how liquid cooling is reshaping the future of AI-ready data centers.
Streaming live on our website from 9am ET (2pm BST) on Wednesday, 13th May.
Liquid cooling readiness for the AI factory era // 9 _am ET
Featuring Jason Matteson, Patrick McCarthy and Matthew Archibald of nVent
As rack densities continue to rise beyond 100kW, liquid cooling is becoming essential for next-generation AI infrastructure. This session explores how operators can design scalable cooling loops, integrate power and thermal architectures more effectively, and prepare facilities for phased AI deployments as cooling moves from the chiller right into the chip.
Rethinking liquid cooling deployment in existing data centers // 10 _am ET
Featuring Alison Deane of ZutaCore and Christopher Sullivan of Oregon State University
Operators are increasingly looking to retrofit existing facilities rather than build from scratch. This session explores how organizations can modernize legacy environments for high-density AI workloads, extend data center lifespan, and prevent cooling from becoming the next infrastructure bottleneck — all while minimizing operational disruption and deployment risk.
Engineering sustainable cooling architectures for efficiency at scale // 11 _am ET
Featuring Mark Johnson, Reece Thomas, Mike Kis and Patrick Cotton of Airedale
Explore how operators are engineering end-to-end thermal management architectures that now extend from the chiller plant to the chip itself — balancing efficiency, resilience, scalability, and environmental performance as AI-driven density continues to accelerate.
Tech Showcase: Measuring the reliability of quick disconnect innovations // 12p _m ET
Featuring Dylan Osiecki of CPC
This technical showcase explores how evolving testing standards, dry-break non-spill quick disconnect technologies, and real-world validation methods are improving reliability in liquid cooled AI environments — helping operators reduce maintenance risk, protect critical infrastructure, and scale deployments with greater operational confidence.
Innovations in liquid cooling for high-density workloads // 12.30p _m ET
Featuring Prof. Yogendra Joshi of Georgia Institute of Technology, Prof. Srikanth Rangarajan of Binghamton University, Prof. Bahgat Sammakia of Binghamton University, and Pritish Parida, Senior Research Scientist at IBM Research
Hear from leading academic and industry researchers as they explore the next generation of liquid cooling innovation for high-density AI workloads - from advanced thermal management techniques and chip-level cooling strategies to the future of sustainable, ultra-efficient compute infrastructure.
I've dropped a link to this broadcast in the calendar invite attached so you don't miss it. You can also stream it on-demand here.
Kind regards,
James Raddings
Digital Portfolio Lead | DCD
DCD, 32-38 Saffron Hill, London, London, London, United Kingdom, EC1N 8FH